๐ ๐ญ๐ฐ๐ฐ๐ฌ ๐ข๐ต ๐ต๐ฉ๐ฆ ๐ฆ๐ฒ๐ถ๐ช๐ฑ๐ฎ๐ฆ๐ฏ๐ต & ๐ฑ๐ณ๐ฐ๐ค๐ฆ๐ด๐ด๐ฆ๐ด ๐ด๐ต๐ข๐ฏ๐ฅ๐ช๐ฏ๐จ ๐ฃ๐ฆ๐ต๐ธ๐ฆ๐ฆ๐ฏ ๐บ๐ฐ๐ถ๐ณ ๐ฃ๐ฐ๐ข๐ณ๐ฅ ๐ฅ๐ฆ๐ด๐ช๐จ๐ฏ & ๐ข ๐ฅ๐ฆ๐ง๐ฆ๐ค๐ต๐ช๐ท๐ฆ ๐ด๐ฉ๐ช๐ฑ๐ฎ๐ฆ๐ฏ๐ต.
๐๐ซ๐จ๐ฌ๐ฌ-๐๐๐๐ญ๐ข๐จ๐ง ๐๐จ๐ง๐ญ๐ซ๐จ๐ฅ: ๐๐๐๐ข๐ง๐ ๐๐ก๐๐ญ’๐ฌ ๐๐๐ญ๐ฎ๐๐ฅ๐ฅ๐ฒ ๐๐ง๐ฌ๐ข๐๐ ๐ญ๐ก๐ ๐๐จ๐๐ซ๐
A PCB’s outer layers can look flawless while copper-thickness variation, interlayer delamination and through-hole plating voids remain entirely hidden. The only way to know for certain is to look inside the board. That’s what cross-section analysis does.
How we control it:
โขย ย ย ย ย ๐๐ถ๐ต๐ฐ๐ฎ๐ข๐ต๐ช๐ค ๐๐ข๐ฎ๐ฑ๐ญ๐ช๐ฏ๐จ ๐๐ข๐ค๐ฉ๐ช๐ฏ๐ฆ:ย A low-speed diamond saw precisely cuts a sample from the required location. Slow, controlled cutting avoids heat damage that could distort or mask the structure we’re examining.
โขย ย ย ย ย ๐๐ฆ๐ต๐ข๐ญ๐ญ๐ฐ๐จ๐ณ๐ข๐ฑ๐ฉ๐ช๐ค ๐๐ณ๐ช๐ฏ๐ฅ๐ช๐ฏ๐จ & ๐๐ฐ๐ญ๐ช๐ด๐ฉ๐ช๐ฏ๐จ ๐๐ข๐ค๐ฉ๐ช๐ฏ๐ฆ:ย The sample is ground through progressively finer abrasive grits and polished to a scratch-free mirror finish, revealing true copper thickness and plating detail rather than cutting artifacts.
โขย ย ย ย ย ๐๐ฆ๐ต๐ข๐ญ๐ญ๐ฐ๐จ๐ณ๐ข๐ฑ๐ฉ๐ช๐ค ๐๐ช๐ค๐ณ๐ฐ๐ด๐ค๐ฐ๐ฑ๐ฆ:ย High-magnification 2D imaging of the polished cross-section lets us measure via and through-hole copper thickness, detect delamination or voids and evaluate plating uniformity. This is our workhorse for routine batch verification.
โขย ย ย ย ย ๐๐๐ 3๐ ๐๐ช๐จ๐ช๐ต๐ข๐ญ ๐๐ช๐ค๐ณ๐ฐ๐ด๐ค๐ฐ๐ฑ๐ฆ:ย For cases needing more than a flat image, this system reconstructs a three-dimensional surface model from multiple focal planes, directly measuring pad flatness, corrosion pit depth and delamination gap width rather than estimating them from a 2D cross-section.
It’s the tool we reach for on high-standard shipment verification and detailed nickel corrosion analysis.
The sample workflow:
โ grind and polish to a mirror finish
โ observe under metallographic or 3D microscopy
Every step preserves the true internal structure. We measure what’s actually there, not a cutting or polishing artifact.
Why it matters:ย no amount of surface inspection will catch internal defects. Cross-section verification confirms what’s inside every batch instead of just what’s visible on top.
๐๐ก๐ ๐๐จ๐ญ๐ญ๐จ๐ฆ ๐๐ข๐ง๐
None of this equipment exists merely to check a box on a quality certificate. Dimensional drift, nickel corrosion and internal structural defects are the three failure modes most likely to turn into your problem after the board leaves our dock. Each requires a purpose-built method to catch before shipment.
This process runs behind every panel we ship. We’re glad to walk through inspection reports, cross-section samples or SEM/EDS data for any batch.
๐๐๐๐๐ ๐ค๐ช๐ฉ ๐ฉ๐ค ๐จ๐๐ก๐๐จ@๐๐๐ง๐๐๐ฉ๐ฅ๐๐.๐๐ค๐ข for more information!
